FORMATION METHOD FOR FILM PATTERN AND FORMATION EQUIPMENT, AND CIRCUIT ELEMENT
PROBLEM TO BE SOLVED: To provide a formation method for a film pattern that can improve adhesion between a film pattern and a substrate. SOLUTION: The formation method for a film pattern includes steps of forming a self-organizing film on a substrate surface which has fluid repellency, providing a f...
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| creator | TAKIGUCHI HIROSHI SHIOTANI ETSUKO |
| description | PROBLEM TO BE SOLVED: To provide a formation method for a film pattern that can improve adhesion between a film pattern and a substrate. SOLUTION: The formation method for a film pattern includes steps of forming a self-organizing film on a substrate surface which has fluid repellency, providing a fluid material on the self-organizing film and drying it, giving energy to the back side of the substrate, and sintering the dried fluid material. COPYRIGHT: (C)2005,JPO&NCIPI |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES |
| title | FORMATION METHOD FOR FILM PATTERN AND FORMATION EQUIPMENT, AND CIRCUIT ELEMENT |
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