FORMATION METHOD FOR FILM PATTERN AND FORMATION EQUIPMENT, AND CIRCUIT ELEMENT

PROBLEM TO BE SOLVED: To provide a formation method for a film pattern that can improve adhesion between a film pattern and a substrate. SOLUTION: The formation method for a film pattern includes steps of forming a self-organizing film on a substrate surface which has fluid repellency, providing a f...

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Hauptverfasser:	TAKIGUCHI HIROSHI, SHIOTANI ETSUKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a formation method for a film pattern that can improve adhesion between a film pattern and a substrate. SOLUTION: The formation method for a film pattern includes steps of forming a self-organizing film on a substrate surface which has fluid repellency, providing a fluid material on the self-organizing film and drying it, giving energy to the back side of the substrate, and sintering the dried fluid material. COPYRIGHT: (C)2005,JPO&NCIPI