THICKNESS MEASUREMENT DEVICE, INSPECTION APPARATUS, MANUFACTURING SYSTEM AND THICKNESS MEASURING METHOD

PROBLEM TO BE SOLVED: To provide a thickness measurement device accurately measuring thickness values of an object to be measured which has minute irregularities on its surface. SOLUTION: The device is provided with: a distance sensor 11 which irradiates an object surface to be measured with a laser...

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Bibliographische Detailangaben
Hauptverfasser: SHINKAWA SHINTARO, IIDA TAKASHI, KOTEGAWA KENJI, TEJIMA KEIJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thickness measurement device accurately measuring thickness values of an object to be measured which has minute irregularities on its surface. SOLUTION: The device is provided with: a distance sensor 11 which irradiates an object surface to be measured with a laser beam L for the measurement, receives reflection right R of the laser beam L, and outputs an output signal S specifying a distance value between itself and the object surface to be measured; a moving mechanism moving a ceramic plate 41, whose surface 41a is made flat or almost flat; a control section which controls the moving mechanism so that the ceramic plate 41 comes into contact with a surface of a case body 32 and which controls the distance sensor 11 so as to irradiate the surface 41a of the ceramic plate 41 with the laser beam L and to output the output signal S; and a measurement section which measures the thickness value of the case body 32, on the basis of the output signal S. COPYRIGHT: (C)2005,JPO&NCIPI