BGA PACKAGE, PACKAGE STACKING STRUCTURE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a BGA package and its manufacturing method and a package stacking structure, in which a plurality of unit packages of the BGA package are stacked. SOLUTION: The package comprises a substrate 220, a semiconductor chip 200 glued on the substrate, a plurality of solder balls 260 on the upper surface of the semiconductor chip, and a sealing material 280 which covers the semiconductor chip on the substrate with the solder balls exposed. Thus process order of this BGA packaging method, in which solder balls are applied in advance of encapsulation process, is different from the conventional method, in which solder balls are adhered after encapsulation. This order enables manufacture of the packages, without additional patterning process or additional substrate for adhering solder balls in the direction of the upper surface of the semiconductor chip. COPYRIGHT: (C)2005,JPO&NCIPI