WIRING SUBSTRATE AND ELECTRONIC EQUIPMENT USING THE SAME

PROBLEM TO BE SOLVED: To provide a wiring substrate which can avoid generation of a large recess on the surface of an insulating substrate and thus can suitably mount an electronic component thereon, and also electronic equipment which can be suitably mounted on an external electric circuit board. SOLUTION: The wiring substrate comprises an insulating substrate 1 made of a plurality of laminated insulating layers 2, through-conductors 4 provided to be passed through the plurality of insulating layers 2, and conductor layers 3 provided between the plurality of insulating layers 2 having the through-conductors 4 passed therethrough and having an opening A surrounding the through-conductors 4. The conductor layer 3 has a plurality of projections B extruded from the edge of the opening A toward the center of the opening A. COPYRIGHT: (C)2005,JPO&NCIPI