SINGLE-SIDED MIRROR PLANE WAFER AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a single-sided mirror plane wafer which can reduce the occurrence of particles, can eliminate the contamination by heavy metals and deterioration of surrounding environment, and allows the efficient and stable formation of a distorted layer; and also to provide its m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURAYAMA KATSUHIKO, HIROSHIGE TAKESHI, OKAWA SHINJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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