SINGLE-SIDED MIRROR PLANE WAFER AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a single-sided mirror plane wafer which can reduce the occurrence of particles, can eliminate the contamination by heavy metals and deterioration of surrounding environment, and allows the efficient and stable formation of a distorted layer; and also to provide its manufacturing method. SOLUTION: The rear face of a silicon wafer W is polished by green-color silicon carbide (a) to form the distorted layer Wa. Consequently, compared with the conventional method using a suspension containing loose abrasive grains, an attachment amount of polishing abrasive grains to the wafer W can be reduced, resulting in reducing the occurrence of particles on the surface of the wafer and eventually reducing the frequency of occurrence of inferior goods in a wafer manufacturing process and in a device process. Furthermore, heavy metal contamination by the suspension and the deterioration of surrounding environment by mist of the suspension can be eliminated, and the distorted layer Wa can be formed efficiently and stably. COPYRIGHT: (C)2005,JPO&NCIPI