METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide equipment for manufacturing a semiconductor device, in which a plurality of sheets arranged at a specified interval are fed collectively to a cooler, and the sheets can be bonded, without using a Teflon (R) sheet, or the like. SOLUTION: An insulating resin sheet subs...

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Hauptverfasser: WATANABE NAOTAKE, IKETANI YUKIHIRO, YOSHIOKA SHINPEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WATANABE NAOTAKE
IKETANI YUKIHIRO
YOSHIOKA SHINPEI
description PROBLEM TO BE SOLVED: To provide equipment for manufacturing a semiconductor device, in which a plurality of sheets arranged at a specified interval are fed collectively to a cooler, and the sheets can be bonded, without using a Teflon (R) sheet, or the like. SOLUTION: An insulating resin sheet substrate 7 is cut into a plurality of pieces together with a second protective film 6 while leaving a first protective film 5. A part of the insulating resin sheet substrate 7 thus cut and the second protective film 6 are then removed to form a plurality of sheets 2 arranged on the first protective film at specified intervals. Subsequently, the plurality of sheets 2 arranged on the first protective film at a specified interval are fed collectively onto a cooler 1. Thereafter, the plurality of sheets 2 are hot pressed via the first protective film 5 by means of a heater 10 and boded to the cooler 1. Finally, the first protective film 5 is stripped, and a conductor 3 having a semiconductor chip 4 is bonded onto the plurality of sheets 2. COPYRIGHT: (C)2005,JPO&NCIPI
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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