METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide equipment for manufacturing a semiconductor device, in which a plurality of sheets arranged at a specified interval are fed collectively to a cooler, and the sheets can be bonded, without using a Teflon (R) sheet, or the like. SOLUTION: An insulating resin sheet substrate 7 is cut into a plurality of pieces together with a second protective film 6 while leaving a first protective film 5. A part of the insulating resin sheet substrate 7 thus cut and the second protective film 6 are then removed to form a plurality of sheets 2 arranged on the first protective film at specified intervals. Subsequently, the plurality of sheets 2 arranged on the first protective film at a specified interval are fed collectively onto a cooler 1. Thereafter, the plurality of sheets 2 are hot pressed via the first protective film 5 by means of a heater 10 and boded to the cooler 1. Finally, the first protective film 5 is stripped, and a conductor 3 having a semiconductor chip 4 is bonded onto the plurality of sheets 2. COPYRIGHT: (C)2005,JPO&NCIPI