CONDUCTIVE BALL MOUNTING METHOD, BUMP FORMING METHOD, AND CONDUCTIVE BALL MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a conductive ball mounting method and a bump forming method whereby a bump defect is prevented without the need for an apparatus or an instrument of high accuracy when applying flux in a method of forming bumps on a substrate. SOLUTION: In the conductive ball mountin...

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Hauptverfasser:	ISHIKAWA SHINJI, HASHINO HIDEJI, SASAKI YUKIO, KONO TARO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive ball mounting method and a bump forming method whereby a bump defect is prevented without the need for an apparatus or an instrument of high accuracy when applying flux in a method of forming bumps on a substrate. SOLUTION: In the conductive ball mounting method, flux is applied over an area where at least a circuit is formed on the substrate, and then conductive balls are mounted. In the bump forming method, the conductive ball mounting substrate is heated to melt the conductive balls, and then the conductive balls are cooled and solidified to form the bumps. COPYRIGHT: (C)2005,JPO&NCIPI