MODIFIED EPOXY RESIN, PREPARATION PROCESS THEREFOR, PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT

PROBLEM TO BE SOLVED: To obtain a modified epoxy resin capable to satisfy a characteristic feature required to form a permanent mask on a film form base material like an FPC (flexible printed circuit) cover lay, particularly simultaneously and fully satisfying photosensitivity, resolution rate, a fi...

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Bibliographische Detailangaben
Hauptverfasser:	ITAGAKI SHUICHI, YOSHIDA TETSUYA, TSUKADA KATSUSHIGE, TSUCHIYA KATSUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a modified epoxy resin capable to satisfy a characteristic feature required to form a permanent mask on a film form base material like an FPC (flexible printed circuit) cover lay, particularly simultaneously and fully satisfying photosensitivity, resolution rate, a film forming property, a solder heat resistance, plating resistance and flexibility, a process for its preparation and a photosensitive resin composition. SOLUTION: The modified epoxy resin has a repetitive unit shown by formula (1), wherein R1represents a bivalent organic group of a diglycidyl ether type epoxy compound residue, R2represents a bivalent organic group of a dibasic acid residue, R3represents hydrogen atom or a group of formula (2) wherein R4represents an acid anhydride residue, and (n) represents an integer of 1 or over. COPYRIGHT: (C)2005,JPO&NCIPI