METHOD FOR MOUNTING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a mounting method of electronic components that is excellent in functions and mounting quality and is capable of low-cost mounting in a high-density electronic circuit. SOLUTION: When a plurality of various electronic components are mounted for forming a specified el...

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Bibliographische Detailangaben
Hauptverfasser:	TSUMURA TETSUYA, ODANE KAZUHITO, MURAKAMI KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting method of electronic components that is excellent in functions and mounting quality and is capable of low-cost mounting in a high-density electronic circuit. SOLUTION: When a plurality of various electronic components are mounted for forming a specified electronic circuit on one surface of at least a circuit board 9, the electronic components are aligned and arranged at a specified position by an electronic component aligning tool 1, collectively sucked by a vacuum chuck 5, transferred to a specified position on the circuit board 9 in a mounting unit 8, and collectively transferred to a specified position on one surface in the circuit board 9. COPYRIGHT: (C)2005,JPO&NCIPI