ELECTROMAGNETIC WAVE SHIELDING TRANSFER FILM

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding transfer film capable of imparting a wiring circuit board with excellent electromagnetic wave shielding properties and flexibility, as well as excellent productivity and significant cost reduction, by transferring an electromagnetic...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA KOJI, FUJII GENYO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding transfer film capable of imparting a wiring circuit board with excellent electromagnetic wave shielding properties and flexibility, as well as excellent productivity and significant cost reduction, by transferring an electromagnetic wave shielding transfer film to the wiring circuit board to form a coating layer thereon. SOLUTION: In the electromagnetic wave shielding transfer film, at least a protective layer, a metal thin film layer, and a conductive adhesive layer are formed sequentially on one side of a plastic film. COPYRIGHT: (C)2005,JPO&NCIPI