METHOD FOR MANUFACTURING HIGH-FREQUENCY LAMINATED COMPONENT

PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGATA KOJI, MORIMOTO YOSHIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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