METHOD FOR MANUFACTURING HIGH-FREQUENCY LAMINATED COMPONENT

METHOD FOR MANUFACTURING HIGH-FREQUENCY LAMINATED COMPONENT

PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAGATA KOJI, MORIMOTO YOSHIFUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer electrode. SOLUTION: A recess 11 is formed at a position in contact with an inner-layer electrode 1 on the lower surface of a laminated sheet 2 laminated onto the laminated sheet 2 having the inner-layer electrode 1, thus accommodating the inner-layer electrode into the recess and hence improving the flatness in the high-frequency laminated component. COPYRIGHT: (C)2005,JPO&NCIPI