METHOD FOR MANUFACTURING HIGH-FREQUENCY LAMINATED COMPONENT

PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer e...

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Hauptverfasser:	NAGATA KOJI, MORIMOTO YOSHIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	NAGATA KOJI MORIMOTO YOSHIFUMI
description	PROBLEM TO BE SOLVED: To increase flatness in a high-frequency laminated component for high-density packaging and high integration in a high-frequency part for the manufacturing method of the high-frequency laminated component for forming a high-frequency circuit especially by using an inner-layer electrode. SOLUTION: A recess 11 is formed at a position in contact with an inner-layer electrode 1 on the lower surface of a laminated sheet 2 laminated onto the laminated sheet 2 having the inner-layer electrode 1, thus accommodating the inner-layer electrode into the recess and hence improving the flatness in the high-frequency laminated component. COPYRIGHT: (C)2005,JPO&NCIPI
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SOLUTION: A recess 11 is formed at a position in contact with an inner-layer electrode 1 on the lower surface of a laminated sheet 2 laminated onto the laminated sheet 2 having the inner-layer electrode 1, thus accommodating the inner-layer electrode into the recess and hence improving the flatness in the high-frequency laminated component. 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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	METHOD FOR MANUFACTURING HIGH-FREQUENCY LAMINATED COMPONENT
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