SOLDERING DEVICE

PROBLEM TO BE SOLVED: To apply solder to a plurality of bonding places simultaneously and surely. SOLUTION: A plurality of terminals 37 are attached onto a first substrate 36 retained on a retainer 34 as a first material 35 to be bonded, and solder is adhered to the same while a plurality of termina...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOTANI MAKOTO, MIYAKE TOSHIHIRO, ITO ICHIRO, SUMINO HIDEYUKI, WATASE TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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