SOLDERING DEVICE

PROBLEM TO BE SOLVED: To apply solder to a plurality of bonding places simultaneously and surely. SOLUTION: A plurality of terminals 37 are attached onto a first substrate 36 retained on a retainer 34 as a first material 35 to be bonded, and solder is adhered to the same while a plurality of terminals 42 are attached onto a second substrate 41 as a second material 40 to be bonded, which is overlapped on the first material 35 to be bonded. In order to solder these terminal groups simultaneously, a near infrared rays irradiating unit 7 is provided to irradiate near infrared ray beams 6 against the bonding place. On the other hand, a pusher comb plate 2 consisting of a leaf spring pushes down the second material 40 to be bonded. Even in a part whereat a gap is generated between these materials due to the recesses and projections of a plurality of terminals 37 or the same 42, the generation of the gap is prevented by slightly deforming the substrate 41 with the pusher comb plate 2. Further, a heating means for heating the retainer 34 additionally can be provided. COPYRIGHT: (C)2005,JPO&NCIPI