IN-PRINT METHOD AND IN-PRINT DEVICE

IN-PRINT METHOD AND IN-PRINT DEVICE

PROBLEM TO BE SOLVED: To improve the positioning precision between a mold and a workpiece, and also to improve throughput in an in-print process. SOLUTION: A plurality of substrates 50 are fixed onto a chuck stage 20 by a vacuum suction hole 24 and each substrate 50 can be selectively, successively...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ARIGA TAKESHI, HAGIWARA JUNICHI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve the positioning precision between a mold and a workpiece, and also to improve throughput in an in-print process. SOLUTION: A plurality of substrates 50 are fixed onto a chuck stage 20 by a vacuum suction hole 24 and each substrate 50 can be selectively, successively heated by a work heater 21 and a cooling line 22. A mold 40 for in-print is fixed to a head plate 30 and is arranged opposite to the substrate 50, the positions of the mold 40 for in-print and the substrate 50 are detected by a mold position detecting camera 14 and a work position detecting camera 15, and in-print operation where a positioning mechanism 10 independently positions/presses each selectively heated substrate 50 is successively repeated to the mold 40 for in-printing all substrates 50. COPYRIGHT: (C)2005,JPO&NCIPI