CONDUCTIVE ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING THIS

PROBLEM TO BE SOLVED: To provide a conductive adhesive film superior in conductivity and adhesive at low temperatures and a semiconductor device using the same. SOLUTION: The conductive adhesive film is constructed of a resin composition containing an acrylic resin and a conductive particle. The sem...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAGAWA DAISUKE, TAKAYAMA RIE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive adhesive film superior in conductivity and adhesive at low temperatures and a semiconductor device using the same. SOLUTION: The conductive adhesive film is constructed of a resin composition containing an acrylic resin and a conductive particle. The semiconductor device has a semiconductor element and a support member joined through the conductive adhesive film. COPYRIGHT: (C)2005,JPO&NCIPI