LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide laminated boards, multilayer printed circuit boards, prepregs and electronic products using those, which have small in-plane thermal expansion coefficient and low elasticity thermal stress. SOLUTION: The laminated board can carry semiconductor elements and has a resin part having a sea island structure and an insulating layer composed of a fabric-reinforcing material, wherein in-plane thermal expansion coefficient of the insulating layer is 3.0-10 ppm/K and glass-transition temperature of the insulating layer is 150-300°C. Thereby, the in-plane thermal expansion coefficient and the elastic modulus of the laminated board, multilayer printed circuit board and prepreg are much decreased and, thereby, thermal stress of the mounted surface is largely decreased. And the reliability upon the connection to mounted element such as an LSI can be notably enhanced. COPYRIGHT: (C)2005,JPO&NCIPI