WIDE COPPER CLAD LAMINATED BOARD

PROBLEM TO BE SOLVED: To provide a wide copper clad laminated board having a copper plating film formed thereon without using a heat-resistant adhesive or the like at all, enabling the formation of a fine wiring pattern and reducing the occurrence of trouble in a post-processing process. SOLUTION: P...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMOKAWA HIROTO, KATSUKI SHOZO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wide copper clad laminated board having a copper plating film formed thereon without using a heat-resistant adhesive or the like at all, enabling the formation of a fine wiring pattern and reducing the occurrence of trouble in a post-processing process. SOLUTION: Plating is applied to a polyimide film with a width of 540 mm or above, on which a metal membrane is formed using a membrane forming method, using a vertically feeding type plating method to obtain the wide copper clad laminated board having a copper electroplating layer characterized in that the number of abnormal projections with a diameter of 15 μm or above on the surface of the plating layer is 0-200 /mm2and a region of a copper film thickness distribution ±10% or below in the width direction thereof is 80% or above of the total width. COPYRIGHT: (C)2005,JPO&NCIPI