SHEET-LIKE SUBSTRATE AND ELECTRONIC PART

PROBLEM TO BE SOLVED: To provide a sheet-like substrate and electronic parts by which mounting failure due to the movement of a sheet can be prevented at the time of sticking the sheet-like substrate constituted of forming passive elements such as capacitor elements on an organic film to a circuit b...

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Bibliographische Detailangaben
Hauptverfasser: HIGASHIDA TAKAAKI, TAKAMOTO YUKINORI
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a sheet-like substrate and electronic parts by which mounting failure due to the movement of a sheet can be prevented at the time of sticking the sheet-like substrate constituted of forming passive elements such as capacitor elements on an organic film to a circuit board or the electronic part. SOLUTION: On the sheet-like substrate 10, electrode terminals 22, 24, 26 connected to the capacitor elements 20 are formed on a polyimide film 15 like columns, and through holes 50 are respectively formed between the column-like electrode terminals 22, 24, 26. When the circuit board and the electrode terminals 22, 24, 26 of the polyimide film 15 are soldered each other, gas is generated from solder flux or the like, but the gas is released from the through holes 50 to the outside. COPYRIGHT: (C)2005,JPO&NCIPI