EVAPORATION SOURCE FOR METAL MATERIAL IN DEPOSITION APPARATUS AND THE DEPOSITION APPARATUS
PROBLEM TO BE SOLVED: To provide an evaporation source for metal materials in a highly useful deposition apparatus removing the defect in a high frequency induction heating method with a simple structure and capable of depositing a metal thin film stably for a long time at low cost, and the depositi...
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| creator | MAKI SHUJI YANAGI YUJI UJIHARA TAKASHI |
| description | PROBLEM TO BE SOLVED: To provide an evaporation source for metal materials in a highly useful deposition apparatus removing the defect in a high frequency induction heating method with a simple structure and capable of depositing a metal thin film stably for a long time at low cost, and the deposition apparatus. SOLUTION: In the deposition apparatus for heating to evaporate a metal material 1 by the high frequency induction heating method so that the metal material 1 is attached onto a substrate 2, thereby depositing a metal thin film on the substrate 2, the evaporation source for metal material includes a container 5 containing the metal material 1 and an induction coils 6 arranged in the vicinity of the container 5. The container 5 is made of a material not heated by the high frequency induction heating. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: In the deposition apparatus for heating to evaporate a metal material 1 by the high frequency induction heating method so that the metal material 1 is attached onto a substrate 2, thereby depositing a metal thin film on the substrate 2, the evaporation source for metal material includes a container 5 containing the metal material 1 and an induction coils 6 arranged in the vicinity of the container 5. The container 5 is made of a material not heated by the high frequency induction heating. 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SOLUTION: In the deposition apparatus for heating to evaporate a metal material 1 by the high frequency induction heating method so that the metal material 1 is attached onto a substrate 2, thereby depositing a metal thin film on the substrate 2, the evaporation source for metal material includes a container 5 containing the metal material 1 and an induction coils 6 arranged in the vicinity of the container 5. The container 5 is made of a material not heated by the high frequency induction heating. COPYRIGHT: (C)2005,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhyDXMM8A9yDPH091MI9g8NcnZVcPMPUvB1DXH0UfB1DHEN8gQyPP0UXFwD_IM9weocAwIcgVpCgxUc_VwUQjxcsUryMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNTA2MLMxMzR2OiFAEA2RwyhA</recordid><startdate>20050210</startdate><enddate>20050210</enddate><creator>MAKI SHUJI</creator><creator>YANAGI YUJI</creator><creator>UJIHARA TAKASHI</creator><scope>EVB</scope></search><sort><creationdate>20050210</creationdate><title>EVAPORATION SOURCE FOR METAL MATERIAL IN DEPOSITION APPARATUS AND THE DEPOSITION APPARATUS</title><author>MAKI SHUJI ; YANAGI YUJI ; UJIHARA TAKASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005038646A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MAKI SHUJI</creatorcontrib><creatorcontrib>YANAGI YUJI</creatorcontrib><creatorcontrib>UJIHARA TAKASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAKI SHUJI</au><au>YANAGI YUJI</au><au>UJIHARA TAKASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EVAPORATION SOURCE FOR METAL MATERIAL IN DEPOSITION APPARATUS AND THE DEPOSITION APPARATUS</title><date>2005-02-10</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide an evaporation source for metal materials in a highly useful deposition apparatus removing the defect in a high frequency induction heating method with a simple structure and capable of depositing a metal thin film stably for a long time at low cost, and the deposition apparatus. SOLUTION: In the deposition apparatus for heating to evaporate a metal material 1 by the high frequency induction heating method so that the metal material 1 is attached onto a substrate 2, thereby depositing a metal thin film on the substrate 2, the evaporation source for metal material includes a container 5 containing the metal material 1 and an induction coils 6 arranged in the vicinity of the container 5. The container 5 is made of a material not heated by the high frequency induction heating. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | EVAPORATION SOURCE FOR METAL MATERIAL IN DEPOSITION APPARATUS AND THE DEPOSITION APPARATUS |
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