EVAPORATION SOURCE FOR METAL MATERIAL IN DEPOSITION APPARATUS AND THE DEPOSITION APPARATUS

PROBLEM TO BE SOLVED: To provide an evaporation source for metal materials in a highly useful deposition apparatus removing the defect in a high frequency induction heating method with a simple structure and capable of depositing a metal thin film stably for a long time at low cost, and the depositi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MAKI SHUJI, YANAGI YUJI, UJIHARA TAKASHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an evaporation source for metal materials in a highly useful deposition apparatus removing the defect in a high frequency induction heating method with a simple structure and capable of depositing a metal thin film stably for a long time at low cost, and the deposition apparatus. SOLUTION: In the deposition apparatus for heating to evaporate a metal material 1 by the high frequency induction heating method so that the metal material 1 is attached onto a substrate 2, thereby depositing a metal thin film on the substrate 2, the evaporation source for metal material includes a container 5 containing the metal material 1 and an induction coils 6 arranged in the vicinity of the container 5. The container 5 is made of a material not heated by the high frequency induction heating. COPYRIGHT: (C)2005,JPO&NCIPI