INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT
PROBLEM TO BE SOLVED: To provide a reliable integrated circuit device and a contactless IC card using it. SOLUTION: After performing the die bonding of an integrated circuit 14 onto a die pad 13a of a lead frame 13 by the use of an epoxy adhesive, two antenna lands 13b of the lead frame 13 and two a...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KASHIMA MASANORI |
| description | PROBLEM TO BE SOLVED: To provide a reliable integrated circuit device and a contactless IC card using it. SOLUTION: After performing the die bonding of an integrated circuit 14 onto a die pad 13a of a lead frame 13 by the use of an epoxy adhesive, two antenna lands 13b of the lead frame 13 and two antenna pads 14a of the integrated circuit 14 are subjected to bonding connection by a bonding wire 15. The die pad 13a is surrounded by two antenna lands 13b, connected to the lead frame 13 by a tie bar 13c, and disposed so as to separate two antenna lands 13b at a separation part 16a in a diagonal direction of the rectangular integrated circuit 14. When an external force is applied to the integrated circuit device 12, the breakage of the built-in integrated circuit 14 and the disconnection of the bonding wire 15 can be prevented. Furthermore, in the contactless IC card with the integrated circuit device 12 mounted in parallel with the contour of the card likewise, the breakage and disconnection of the integrated circuit 14 can be prevented in the practical use of the card. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005038232A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005038232A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005038232A3</originalsourceid><addsrcrecordid>eNrjZLDy9AtxdQ9yDHF1UXD2DHIO9QxRcHEN83R2VXD0Awr5-4U4Oof4uAYHK3g6Kzg7BrkohAZ7-rkreIbwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNTA2MLI2MjR2OiFAEA4NApEA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT</title><source>esp@cenet</source><creator>KASHIMA MASANORI</creator><creatorcontrib>KASHIMA MASANORI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a reliable integrated circuit device and a contactless IC card using it. SOLUTION: After performing the die bonding of an integrated circuit 14 onto a die pad 13a of a lead frame 13 by the use of an epoxy adhesive, two antenna lands 13b of the lead frame 13 and two antenna pads 14a of the integrated circuit 14 are subjected to bonding connection by a bonding wire 15. The die pad 13a is surrounded by two antenna lands 13b, connected to the lead frame 13 by a tie bar 13c, and disposed so as to separate two antenna lands 13b at a separation part 16a in a diagonal direction of the rectangular integrated circuit 14. When an external force is applied to the integrated circuit device 12, the breakage of the built-in integrated circuit 14 and the disconnection of the bonding wire 15 can be prevented. Furthermore, in the contactless IC card with the integrated circuit device 12 mounted in parallel with the contour of the card likewise, the breakage and disconnection of the integrated circuit 14 can be prevented in the practical use of the card. COPYRIGHT: (C)2005,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BOOK COVERS ; BOOKBINDING ; CALCULATING ; COMPUTING ; COUNTING ; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILES ; HANDLING RECORD CARRIERS ; LOOSE LEAVES ; MOVABLE-STRIP WRITING OR READING APPARATUS ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES ; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES ; SPECIAL PRINTED MATTER ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050210&DB=EPODOC&CC=JP&NR=2005038232A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050210&DB=EPODOC&CC=JP&NR=2005038232A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KASHIMA MASANORI</creatorcontrib><title>INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT</title><description>PROBLEM TO BE SOLVED: To provide a reliable integrated circuit device and a contactless IC card using it. SOLUTION: After performing the die bonding of an integrated circuit 14 onto a die pad 13a of a lead frame 13 by the use of an epoxy adhesive, two antenna lands 13b of the lead frame 13 and two antenna pads 14a of the integrated circuit 14 are subjected to bonding connection by a bonding wire 15. The die pad 13a is surrounded by two antenna lands 13b, connected to the lead frame 13 by a tie bar 13c, and disposed so as to separate two antenna lands 13b at a separation part 16a in a diagonal direction of the rectangular integrated circuit 14. When an external force is applied to the integrated circuit device 12, the breakage of the built-in integrated circuit 14 and the disconnection of the bonding wire 15 can be prevented. Furthermore, in the contactless IC card with the integrated circuit device 12 mounted in parallel with the contour of the card likewise, the breakage and disconnection of the integrated circuit 14 can be prevented in the practical use of the card. COPYRIGHT: (C)2005,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BOOK COVERS</subject><subject>BOOKBINDING</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILES</subject><subject>HANDLING RECORD CARRIERS</subject><subject>LOOSE LEAVES</subject><subject>MOVABLE-STRIP WRITING OR READING APPARATUS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</subject><subject>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPECIAL PRINTED MATTER</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDy9AtxdQ9yDHF1UXD2DHIO9QxRcHEN83R2VXD0Awr5-4U4Oof4uAYHK3g6Kzg7BrkohAZ7-rkreIbwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNTA2MLI2MjR2OiFAEA4NApEA</recordid><startdate>20050210</startdate><enddate>20050210</enddate><creator>KASHIMA MASANORI</creator><scope>EVB</scope></search><sort><creationdate>20050210</creationdate><title>INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT</title><author>KASHIMA MASANORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005038232A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BOOK COVERS</topic><topic>BOOKBINDING</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILES</topic><topic>HANDLING RECORD CARRIERS</topic><topic>LOOSE LEAVES</topic><topic>MOVABLE-STRIP WRITING OR READING APPARATUS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</topic><topic>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPECIAL PRINTED MATTER</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KASHIMA MASANORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KASHIMA MASANORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT</title><date>2005-02-10</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a reliable integrated circuit device and a contactless IC card using it. SOLUTION: After performing the die bonding of an integrated circuit 14 onto a die pad 13a of a lead frame 13 by the use of an epoxy adhesive, two antenna lands 13b of the lead frame 13 and two antenna pads 14a of the integrated circuit 14 are subjected to bonding connection by a bonding wire 15. The die pad 13a is surrounded by two antenna lands 13b, connected to the lead frame 13 by a tie bar 13c, and disposed so as to separate two antenna lands 13b at a separation part 16a in a diagonal direction of the rectangular integrated circuit 14. When an external force is applied to the integrated circuit device 12, the breakage of the built-in integrated circuit 14 and the disconnection of the bonding wire 15 can be prevented. Furthermore, in the contactless IC card with the integrated circuit device 12 mounted in parallel with the contour of the card likewise, the breakage and disconnection of the integrated circuit 14 can be prevented in the practical use of the card. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2005038232A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING |
| title | INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T15%3A02%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KASHIMA%20MASANORI&rft.date=2005-02-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005038232A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |