INTEGRATED CIRCUIT DEVICE AND CONTACTLESS IC CARD USING IT

PROBLEM TO BE SOLVED: To provide a reliable integrated circuit device and a contactless IC card using it. SOLUTION: After performing the die bonding of an integrated circuit 14 onto a die pad 13a of a lead frame 13 by the use of an epoxy adhesive, two antenna lands 13b of the lead frame 13 and two antenna pads 14a of the integrated circuit 14 are subjected to bonding connection by a bonding wire 15. The die pad 13a is surrounded by two antenna lands 13b, connected to the lead frame 13 by a tie bar 13c, and disposed so as to separate two antenna lands 13b at a separation part 16a in a diagonal direction of the rectangular integrated circuit 14. When an external force is applied to the integrated circuit device 12, the breakage of the built-in integrated circuit 14 and the disconnection of the bonding wire 15 can be prevented. Furthermore, in the contactless IC card with the integrated circuit device 12 mounted in parallel with the contour of the card likewise, the breakage and disconnection of the integrated circuit 14 can be prevented in the practical use of the card. COPYRIGHT: (C)2005,JPO&NCIPI