DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD

DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD

PROBLEM TO BE SOLVED: To improve both detection sensitivity and resolution without damaging an object to be inspected and without requiring any large facilities even if defects are inspected by using charged particle beams. SOLUTION: The defect inspection apparatus for inspecting defects for the obj...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KAWASHIMA MASAHITO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KAWASHIMA MASAHITO
description PROBLEM TO BE SOLVED: To improve both detection sensitivity and resolution without damaging an object to be inspected and without requiring any large facilities even if defects are inspected by using charged particle beams. SOLUTION: The defect inspection apparatus for inspecting defects for the object 1 to be inspected by detecting secondary charged particles, transmission charged particles, or transmission scattered charged particles obtained by irradiating the object 1 to be inspected with the charged particle beams 12 comprises an irradiation means for successively applying a plurality of charged particle beams 12a, 12b, 12c having different irradiation angles at each different timing; and a signal processing means for adding and computing the detection signal of the secondary charged particles, transmission charged particle, or transmission scattered charged particles obtained by the irradiation of the charged particle rays 12a, 12b, 12c. Then, the defect inspection apparatus is composed so that defects in the part to be inspected are inspected, based on the result of addition and computation by the signal processing means. COPYRIGHT: (C)2005,JPO&NCIPI
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005037291A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005037291A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005037291A3</originalsourceid><addsrcrecordid>eNrjZLBwcXVzdQ5R8PQLDgDSnv5-Co4BAY5BjiGhwQqOfi4KmPK-riEe_i48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMDUwNjcyNLQ0ZgoRQCwcCjg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD</title><source>esp@cenet</source><creator>KAWASHIMA MASAHITO</creator><creatorcontrib>KAWASHIMA MASAHITO</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve both detection sensitivity and resolution without damaging an object to be inspected and without requiring any large facilities even if defects are inspected by using charged particle beams. SOLUTION: The defect inspection apparatus for inspecting defects for the object 1 to be inspected by detecting secondary charged particles, transmission charged particles, or transmission scattered charged particles obtained by irradiating the object 1 to be inspected with the charged particle beams 12 comprises an irradiation means for successively applying a plurality of charged particle beams 12a, 12b, 12c having different irradiation angles at each different timing; and a signal processing means for adding and computing the detection signal of the secondary charged particles, transmission charged particle, or transmission scattered charged particles obtained by the irradiation of the charged particle rays 12a, 12b, 12c. Then, the defect inspection apparatus is composed so that defects in the part to be inspected are inspected, based on the result of addition and computation by the signal processing means. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050210&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005037291A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050210&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005037291A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWASHIMA MASAHITO</creatorcontrib><title>DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD</title><description>PROBLEM TO BE SOLVED: To improve both detection sensitivity and resolution without damaging an object to be inspected and without requiring any large facilities even if defects are inspected by using charged particle beams. SOLUTION: The defect inspection apparatus for inspecting defects for the object 1 to be inspected by detecting secondary charged particles, transmission charged particles, or transmission scattered charged particles obtained by irradiating the object 1 to be inspected with the charged particle beams 12 comprises an irradiation means for successively applying a plurality of charged particle beams 12a, 12b, 12c having different irradiation angles at each different timing; and a signal processing means for adding and computing the detection signal of the secondary charged particles, transmission charged particle, or transmission scattered charged particles obtained by the irradiation of the charged particle rays 12a, 12b, 12c. Then, the defect inspection apparatus is composed so that defects in the part to be inspected are inspected, based on the result of addition and computation by the signal processing means. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwcXVzdQ5R8PQLDgDSnv5-Co4BAY5BjiGhwQqOfi4KmPK-riEe_i48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMDUwNjcyNLQ0ZgoRQCwcCjg</recordid><startdate>20050210</startdate><enddate>20050210</enddate><creator>KAWASHIMA MASAHITO</creator><scope>EVB</scope></search><sort><creationdate>20050210</creationdate><title>DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD</title><author>KAWASHIMA MASAHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005037291A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWASHIMA MASAHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWASHIMA MASAHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD</title><date>2005-02-10</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To improve both detection sensitivity and resolution without damaging an object to be inspected and without requiring any large facilities even if defects are inspected by using charged particle beams. SOLUTION: The defect inspection apparatus for inspecting defects for the object 1 to be inspected by detecting secondary charged particles, transmission charged particles, or transmission scattered charged particles obtained by irradiating the object 1 to be inspected with the charged particle beams 12 comprises an irradiation means for successively applying a plurality of charged particle beams 12a, 12b, 12c having different irradiation angles at each different timing; and a signal processing means for adding and computing the detection signal of the secondary charged particles, transmission charged particle, or transmission scattered charged particles obtained by the irradiation of the charged particle rays 12a, 12b, 12c. Then, the defect inspection apparatus is composed so that defects in the part to be inspected are inspected, based on the result of addition and computation by the signal processing means. COPYRIGHT: (C)2005,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2005037291A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T20%3A40%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAWASHIMA%20MASAHITO&rft.date=2005-02-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005037291A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true