HEAT-UTILIZING MATERIAL AND ITS APPLICATION

PROBLEM TO BE SOLVED: To provide a heat-utilizing material as a novel type of material that can be utilized over a wide temperature range including a temperature range of 0-150°C. SOLUTION: The heat-utilizing material comprises a host capable of including a guest to form an inclusion compound and/or...

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Bibliographische Detailangaben
Hauptverfasser: MURAKOSHI AKIKO, KAKIUCHI HIROYUKI, CHIN KUNI, ISADA KATSUYA, HIDAKA HIDETO, TAKUMI HIDEAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat-utilizing material as a novel type of material that can be utilized over a wide temperature range including a temperature range of 0-150°C. SOLUTION: The heat-utilizing material comprises a host capable of including a guest to form an inclusion compound and/or an inclusion compound formed such that the host includes the guest wherein the host is an organic compound. A heat storage material or an adsorbent material comprises the heat-utilizing material. A heat storage system includes the heat storage material. An adsorption heat pump or an air-conditioner includes the adsorbent material. COPYRIGHT: (C)2005,JPO&NCIPI