SURFACE ACOUSTIC WAVE APPARATUS

PROBLEM TO BE SOLVED: To provide a surface acoustic wave apparatus having excellent reliability of an electrical connection of a bonding wire to a wire bonding pad. SOLUTION: The surface acoustic wave apparatus 1 includes wire bonding pads 9, 12, 17, 20, and 23 disposed at the outside of an area in which interdigital electrodes 5, 6 are provided in the longitudinal direction of a substrate 4. The surface acoustic wave apparatus 1 further includes a piezoelectric thin film 24 formed to coat the interdigital electrodes 5, 6, and a protective film 25 formed to cover the entire surface of the piezoelectric thin film 24. The wire bonding pads 9, 12, 17, 20, and 23 are electrically connected to electrode lands 31-35 of a package 2 via bonding wires 41-45, and a bonding part reinforcing resins 46, 47 are imparted to parts of the wire bonding pads 9, 12, 17, 20, and 23 to the bonding wires 41-45. COPYRIGHT: (C)2005,JPO&NCIPI