HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD

PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and a heat treatment method in one set of device with which a substrate temperature is changed. SOLUTION: The heat treatment apparatus is provided with a chamber (treatment chamber) 1, a bake plate (heating body) 2 provided in the chamber 1...

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1. Verfasser: IWATA YOSHIKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and a heat treatment method in one set of device with which a substrate temperature is changed. SOLUTION: The heat treatment apparatus is provided with a chamber (treatment chamber) 1, a bake plate (heating body) 2 provided in the chamber 1, a motor slider (changing mechanism) 5 for changing a distance between a substrate W and the bake plate 2 by moving a supporting pin (substrate support) 3 for supporting the substrate W received in the chamber 1, and a personal computer (control unit) 6 for controlling the motor slider 5 whereby the heat treatment of the substrate W is effected by radiation heat from the bake plate 2 while changing a distance between the substrate W and the bake plate 2 step by step or continuously under the control of the personal computer 6. COPYRIGHT: (C)2005,JPO&NCIPI