SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a semiconductor package which can mount in a high density by raising the number of loading semiconductor elements to the maximum limit. SOLUTION: The semiconductor package includes a metallized pattern 12 formed on an upper side surface of an alumina metallized substrate 1, a metallized pattern formed on a lower side surface so that both are connected via a through via 11. A through hole is formed in a metal stem 4, a pellet and the other end of a pin 2 are inserted into the through hole, one distal end face of the pin 2 is brought into contact with the metallized pattern on the lower side surface of the alumina metallized substrate 1 and brazed. The lower end face of the alumina metallized substrate 1 is brought into contact with the upper end face of an upper step 41 of the metal step 4, the alumina metallized substrate 1 is laminated on the metal stem 4, and the pin 2 is fixed to the metal stem 4. A light emitting element 5 and a photodetector 6 are disposed on the alumina metallized substrate 1, and connected by wire bonding to the metallized pattern 12. COPYRIGHT: (C)2005,JPO&NCIPI