PHOTOSENSITIVE RESIN COMPOSITION, LAYERED PRODUCT AND FLEXIBLE WIRING BOARD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in developability and flexibility when an insulating layer of a flexible wiring board is formed, a layered product excellent in developability and flexibility, and a flexible wiring board excellent in flexibility. SOLUTION...

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Bibliographische Detailangaben
Hauptverfasser:	OKUGAWA YOSHITAKA, YASUDA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in developability and flexibility when an insulating layer of a flexible wiring board is formed, a layered product excellent in developability and flexibility, and a flexible wiring board excellent in flexibility. SOLUTION: The photosensitive resin composition used for forming an insulating layer of a flexible wiring board contains a photosensitive resin and a Barcol hardness stipulated by JIS K 7060 after a curing reaction of the photosensitive resin composition is ≤60. The layered product 1 is obtained by stacking a layer 2 consisting of the photosensitive resin composition and a carrier film 3. The flexible wiring board comprises an insulating layer consisting of the photosensitive resin composition and a conductor circuit formed on one side of the insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI