ETCHING SOLUTION FOR COPPER AND COPPER ALLOY

PROBLEM TO BE SOLVED: To provide an etching solution for copper and copper alloys, e.g., useful for the production of a printed circuit board in the field of the electronic industry e.g. SOLUTION: Sulfate, hydrogen sulfate, azoles and carbonate are incorporated into an etching solution comprising sulfate peroxide as the main agent, so that the easily treatable etching solution for copper and copper alloys free from the occurrence of unpleasant gas, having satisfactory work environmental properties, a high ratio (etching factor) between the etching rates in vertical and in horizontal directions and improved etching accuracy is prepared. COPYRIGHT: (C)2005,JPO&NCIPI