ETCHING SOLUTION FOR COPPER AND COPPER ALLOY

PROBLEM TO BE SOLVED: To provide an etching solution for copper and copper alloys, e.g., useful for the production of a printed circuit board in the field of electronic industry, e.g. SOLUTION: The etching solution for copper and copper alloys comprises sulfate peroxide and azoles. The etching rate...

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Bibliographische Detailangaben
Hauptverfasser:	KUWABARA HIDEKO, AZUMA TOMOYUKI, HOSOMI AKIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an etching solution for copper and copper alloys, e.g., useful for the production of a printed circuit board in the field of electronic industry, e.g. SOLUTION: The etching solution for copper and copper alloys comprises sulfate peroxide and azoles. The etching rate in shower treatment is ≥10 times that in dipping treatment. COPYRIGHT: (C)2005,JPO&NCIPI