METHOD FOR PACKAGING SUBSTRATE EXPOSING SURFACE OF MATERIAL AND PACKAGE

PROBLEM TO BE SOLVED: To provide a method for packaging an substrate for efficiently packaging an etched wafer or the like with the surface of a material being exposed at low costs and effectively suppressing oxidation of the surface during storage, and to provide a package. SOLUTION: In a method fo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	UMETSU KAZUYUKI, SUGIURA JUNJI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING CRYSTAL GROWTH ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS METALLURGY PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SEMICONDUCTOR DEVICES SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH STORING TRANSPORTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL UNPACKING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for packaging an substrate for efficiently packaging an etched wafer or the like with the surface of a material being exposed at low costs and effectively suppressing oxidation of the surface during storage, and to provide a package. SOLUTION: In a method for packaging the substrate W with the surface of the material being exposed, a laminated bag P containing the substrate W is placed in a chamber 2, the inside of the chamber 2 is evacuated, while nitrogen gas is supplied into the chamber 2 by supplying the nitrogen gas through a nitrogen gas nozzle 10 inserted in the opening of the laminated bag P, the opening of the laminated bag P is sealed to package the substrate W. Further, after the inside of the chamber 2 is evacuated and the nitrogen gas is supplied, the inside of the chamber 2 is evacuated again to supply nitrogen gas. COPYRIGHT: (C)2005,JPO&NCIPI