SEMICONDUCTOR DEVICE AND LEAD FRAME

PROBLEM TO BE SOLVED: To provide a semiconductor device and a lead frame which are capable of surely preventing the generation of short-circuiting between lead terminals, and in which cutting by a rotary blade is smoothly effected. SOLUTION: A QFN package 1 is equipped with a semiconductor chip 2, a die pad 3 comprising a main surface 3a on which the semiconductor chip 2 is mounted, a plurality of external leads 4 arranged with an interval between each other along the peripheral rims of the die pad 3 and electrically connected to the semiconductor chip 2, and a mold resin 8 comprising side surfaces 8c. The external leads 4 comprise one terminal 5 positioned so as to be opposed to the semiconductor chip 2 and the other terminal 6 exposed from the mold resin 8 and extended on the same plane as the side surfaces 8c. The external leads 4 are formed so that the length of one ends 6 becomes shorter than that of the other ends 5 in the length of the external leads 4 in a direction in which a plurality of external leads 4 are arranged. COPYRIGHT: (C)2005,JPO&NCIPI