MOUNTED PART AND METHOD OF DISMOUNTING THE SAME

PROBLEM TO BE SOLVED: To enable to dismount only a mounted part required through a simple method. SOLUTION: A heating means (3) heats up to a certain temperature solder melts when a current is applied to it, and is provided on the mounted part (1) mounted on a board by soldering. A heat control mean...

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Bibliographische Detailangaben
Hauptverfasser:	HAMA YUKARI, HASHINO HIROYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable to dismount only a mounted part required through a simple method. SOLUTION: A heating means (3) heats up to a certain temperature solder melts when a current is applied to it, and is provided on the mounted part (1) mounted on a board by soldering. A heat control means (4) is also provided on the mounted part (1), and determines on the basis of control signals inputted from the outside whether an electric current is applied to the heating means (3) or not. COPYRIGHT: (C)2005,JPO&NCIPI