LAMINATE, FLEXIBLE WIRING BOARD, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in developing properties and flexibility when the insulating layer of a flexible wiring board is formed, and to provide a laminate excellent in developing properties and in flexibility or the flexible wiring board...

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Bibliographische Detailangaben
Hauptverfasser:	OKUGAWA YOSHITAKA, YASUDA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in developing properties and flexibility when the insulating layer of a flexible wiring board is formed, and to provide a laminate excellent in developing properties and in flexibility or the flexible wiring board excellent in flexibility. SOLUTION: The photosensitive resin composition is used for forming the insulating layer of the flexible wiring board contains acrylic resin provided with an acryloyl group or a methacryloyl group and a carboxyl group in a molecule. A layer 2 formed of the photosensitive resin composition and a carrier film 3 are laminated into the laminate 1. The flexible wiring board is formed with the insulating layer formed of the photosensitive resin composition and a conductor circuit formed on, at least, one side of the insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI