HEAT SINK AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a heat sink that is high in heat radiating efficiency and can be manufactured easily, and to provide a method of manufacturing the heat sink. SOLUTION: The base 2 of the heat sink 1 is composed of a sintered copper compact obtained by molding copper powder by means o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKAI TAKESHI, KITAJIMA HIRONORI, FUKUDA KUNIHIRO, SAKAYORI KAZUSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NAKAI TAKESHI
KITAJIMA HIRONORI
FUKUDA KUNIHIRO
SAKAYORI KAZUSHI
description PROBLEM TO BE SOLVED: To provide a heat sink that is high in heat radiating efficiency and can be manufactured easily, and to provide a method of manufacturing the heat sink. SOLUTION: The base 2 of the heat sink 1 is composed of a sintered copper compact obtained by molding copper powder by means of a press and sintering the molded body. Heat radiating fins 3 are formed in round bar-like shapes which can obtain larger heat radiating areas than plate-shaped bodies, and planted on the base 2. When the molded body is sintered, the air contained in the copper powder is expelled to the outside and the volume of the press-molded copper powder is reduced. When the volume of the copper powder is reduced, the heat radiating fins 3 are fixed to the sintered copper powder. In addition, since the heat radiating fins 3 which can obtain larger heat radiating areas are fixed to the base 2 having a high coefficient of thermal conductivity, the heat sink 1 having high thermal efficiency can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005026255A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005026255A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005026255A3</originalsourceid><addsrcrecordid>eNrjZFDzcHUMUQj29PNWcPRzUfAMCVbwdfQLdXN0DgkN8vRzV_B1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBqYGRmZGpqaOxkQpAgDweyPG</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT SINK AND ITS MANUFACTURING METHOD</title><source>esp@cenet</source><creator>NAKAI TAKESHI ; KITAJIMA HIRONORI ; FUKUDA KUNIHIRO ; SAKAYORI KAZUSHI</creator><creatorcontrib>NAKAI TAKESHI ; KITAJIMA HIRONORI ; FUKUDA KUNIHIRO ; SAKAYORI KAZUSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a heat sink that is high in heat radiating efficiency and can be manufactured easily, and to provide a method of manufacturing the heat sink. SOLUTION: The base 2 of the heat sink 1 is composed of a sintered copper compact obtained by molding copper powder by means of a press and sintering the molded body. Heat radiating fins 3 are formed in round bar-like shapes which can obtain larger heat radiating areas than plate-shaped bodies, and planted on the base 2. When the molded body is sintered, the air contained in the copper powder is expelled to the outside and the volume of the press-molded copper powder is reduced. When the volume of the copper powder is reduced, the heat radiating fins 3 are fixed to the sintered copper powder. In addition, since the heat radiating fins 3 which can obtain larger heat radiating areas are fixed to the base 2 having a high coefficient of thermal conductivity, the heat sink 1 having high thermal efficiency can be obtained. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050127&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005026255A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050127&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005026255A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAI TAKESHI</creatorcontrib><creatorcontrib>KITAJIMA HIRONORI</creatorcontrib><creatorcontrib>FUKUDA KUNIHIRO</creatorcontrib><creatorcontrib>SAKAYORI KAZUSHI</creatorcontrib><title>HEAT SINK AND ITS MANUFACTURING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a heat sink that is high in heat radiating efficiency and can be manufactured easily, and to provide a method of manufacturing the heat sink. SOLUTION: The base 2 of the heat sink 1 is composed of a sintered copper compact obtained by molding copper powder by means of a press and sintering the molded body. Heat radiating fins 3 are formed in round bar-like shapes which can obtain larger heat radiating areas than plate-shaped bodies, and planted on the base 2. When the molded body is sintered, the air contained in the copper powder is expelled to the outside and the volume of the press-molded copper powder is reduced. When the volume of the copper powder is reduced, the heat radiating fins 3 are fixed to the sintered copper powder. In addition, since the heat radiating fins 3 which can obtain larger heat radiating areas are fixed to the base 2 having a high coefficient of thermal conductivity, the heat sink 1 having high thermal efficiency can be obtained. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDzcHUMUQj29PNWcPRzUfAMCVbwdfQLdXN0DgkN8vRzV_B1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBqYGRmZGpqaOxkQpAgDweyPG</recordid><startdate>20050127</startdate><enddate>20050127</enddate><creator>NAKAI TAKESHI</creator><creator>KITAJIMA HIRONORI</creator><creator>FUKUDA KUNIHIRO</creator><creator>SAKAYORI KAZUSHI</creator><scope>EVB</scope></search><sort><creationdate>20050127</creationdate><title>HEAT SINK AND ITS MANUFACTURING METHOD</title><author>NAKAI TAKESHI ; KITAJIMA HIRONORI ; FUKUDA KUNIHIRO ; SAKAYORI KAZUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005026255A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAI TAKESHI</creatorcontrib><creatorcontrib>KITAJIMA HIRONORI</creatorcontrib><creatorcontrib>FUKUDA KUNIHIRO</creatorcontrib><creatorcontrib>SAKAYORI KAZUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAI TAKESHI</au><au>KITAJIMA HIRONORI</au><au>FUKUDA KUNIHIRO</au><au>SAKAYORI KAZUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT SINK AND ITS MANUFACTURING METHOD</title><date>2005-01-27</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a heat sink that is high in heat radiating efficiency and can be manufactured easily, and to provide a method of manufacturing the heat sink. SOLUTION: The base 2 of the heat sink 1 is composed of a sintered copper compact obtained by molding copper powder by means of a press and sintering the molded body. Heat radiating fins 3 are formed in round bar-like shapes which can obtain larger heat radiating areas than plate-shaped bodies, and planted on the base 2. When the molded body is sintered, the air contained in the copper powder is expelled to the outside and the volume of the press-molded copper powder is reduced. When the volume of the copper powder is reduced, the heat radiating fins 3 are fixed to the sintered copper powder. In addition, since the heat radiating fins 3 which can obtain larger heat radiating areas are fixed to the base 2 having a high coefficient of thermal conductivity, the heat sink 1 having high thermal efficiency can be obtained. COPYRIGHT: (C)2005,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2005026255A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HEAT SINK AND ITS MANUFACTURING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-16T12%3A00%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAI%20TAKESHI&rft.date=2005-01-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005026255A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true