WIRING SUBSTRATE AND ELECTRONIC DEVICE USING IT

PROBLEM TO BE SOLVED: To provide a wiring substrate, capable of nicely mounting electronic components since a big recess will not be generated on the surface of an insulating substrate, and an electronic device, capable of being mounted nicely on an external electric circuit substrate. SOLUTION: The wiring substrate is constituted of the insulating substrate, consisting of a plurality of laminated insulating layers, a penetrating conductor 4, provided while penetrating the plurality of insulating layers, and a conductor layer 3, arranged between the plurality of insulating layers penetrated by the penetrating conductor 4 and provided with an opening unit A which surrounds the penetrating conductor 4, while a conductor pattern 5, independent electrically from the penetrating conductor 4 and the conductor layer 3, is arranged around the penetrating conductor 4 in the opening unit A. COPYRIGHT: (C)2005,JPO&NCIPI