SEMICONDUCTOR WAFER PROCESSING PROTECTIVE SHEET AND METHOD OF GRINDING REAR SURFACE OF SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide a semiconductor wafer processing protective sheet which restrains a semiconductor wafer from being warped even when a large-size wafer is thinned through a back grinding process and is laminated or separated with high workability, and to provide a method of grinding the rear surface of the semiconductor wafer by the use of the semiconductor wafer processing protective sheet. SOLUTION: The semiconductor wafer processing protective sheet is used for protecting the front surface of the semiconductor wafer where a pattern is formed while the rear surface of the semiconductor wafer is ground. The protective sheet is equipped with, at least, a low elastic modulus layer which includes an adhesive layer and is laminated on a base material, the low-elastic modulus layer is 100 μm or above in thickness, and has a multilayered structure composed of layers each having a tensile elastic modulus of 0.1 GPa or below at a temperature of 23°C. The base material is single-layered or multilayered, and at least, one of layers has a tensile elastic modulus of 0.6 GPa or above at a temperature of 23°C. COPYRIGHT: (C)2005,JPO&NCIPI