MANUFACTURING METHOD OF ANISOTROPIC CONDUCTIVE FILM

PROBLEM TO BE SOLVED: To provide a manufacturing method of an anisotropic conductive film in which terminal connection excellent in connection reliability and insulation becomes possible at a low cost by arranging regularly conductive particles only in a specified region. SOLUTION: This manufacturin...

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Bibliographische Detailangaben
Hauptverfasser:	OKADA WATARU, KAWAGUCHI TATSUMI, YOSHITOME TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of an anisotropic conductive film in which terminal connection excellent in connection reliability and insulation becomes possible at a low cost by arranging regularly conductive particles only in a specified region. SOLUTION: This manufacturing method of an anisotropic conductive film has a process in which, using a roll 11 of which the protruded part is worked so as to become a desired arrangement pattern, the conductive particles are captured on the surface of the roll 11 when passing through paste 13 dispersed with the conductive particles, then only the conductive particles captured on the protruded part are regularly transferred on the substrate 14 using liquid as a binder. COPYRIGHT: (C)2005,JPO&NCIPI