PUNCHING METHOD, AND PUNCHING DIE DEVICE

PROBLEM TO BE SOLVED: To provide a punching method and a punching die device capable of reliably discharging and taking out a product which is obtained by punching a work with adhesive applied thereto without adhesion to a punch. SOLUTION: The punching die device has an upper mold and a lower mold....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKANO SHINJI, YAMASHITA TATSUHIKO, MORITA HIDEO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a punching method and a punching die device capable of reliably discharging and taking out a product which is obtained by punching a work with adhesive applied thereto without adhesion to a punch. SOLUTION: The punching die device has an upper mold and a lower mold. The upper mold is equipped with: a material holding plate 7 provided with a material holding part 12 with a tapered opening shape diverging downward for performing a preliminary working on the material 1 to be worked to form a shape having a trapezoidal section for accumulating stress in the material 1; a punch 2 provided with a working part 11 at the lower tip end for punching the preliminarily worked projecting surface to give a product 19; a freely movable upper punch plate having a hole 3 through which the punch 2 passes in conjunction with the material holding part 12. The lower mold is equipped with: a punching die 13 having a tapered receiving part 14 corresponding to the material holding part 12 of the material holding plate 7. COPYRIGHT: (C)2005,JPO&NCIPI