METHOD OF MANUFACTURING MICROWAVE CIRCUIT
PROBLEM TO BE SOLVED: To provide a method of manufacturing a microwave circuit, capable of manufacturing a transmission line as thin and narrow as possible, to the extent that the manufacturing process allows. SOLUTION: This method (100) for manufacturing the microwave circuit comprises the steps of...
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creator | CASEY JOHN F DOVE LEWIS R RAU R FREDERICK JR DREHLE JAMES R JOHNSON ROSEMARY O LIU LING |
description | PROBLEM TO BE SOLVED: To provide a method of manufacturing a microwave circuit, capable of manufacturing a transmission line as thin and narrow as possible, to the extent that the manufacturing process allows. SOLUTION: This method (100) for manufacturing the microwave circuit comprises the steps of (a) depositing (102) a thick dielectric over a ground plane comprising (i) depositing (106) a first thick dielectric layer over the ground plane, (ii) drying (108) the first layer to degas a solvent to increase the porosity of the first layer, (iii) in-furnace drying (110) the first layer, (iv) depositing (112) an additional thick dielectric layer on the upper surface of the first layer and carry out furnace drying, after the deposition of the respective layers, and (v) baking (114) the deposited layers, and (b) of forming (104) a conductor on the thick dielectric. COPYRIGHT: (C)2005,JPO&NCIPI |
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SOLUTION: This method (100) for manufacturing the microwave circuit comprises the steps of (a) depositing (102) a thick dielectric over a ground plane comprising (i) depositing (106) a first thick dielectric layer over the ground plane, (ii) drying (108) the first layer to degas a solvent to increase the porosity of the first layer, (iii) in-furnace drying (110) the first layer, (iv) depositing (112) an additional thick dielectric layer on the upper surface of the first layer and carry out furnace drying, after the deposition of the respective layers, and (v) baking (114) the deposited layers, and (b) of forming (104) a conductor on the thick dielectric. 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SOLUTION: This method (100) for manufacturing the microwave circuit comprises the steps of (a) depositing (102) a thick dielectric over a ground plane comprising (i) depositing (106) a first thick dielectric layer over the ground plane, (ii) drying (108) the first layer to degas a solvent to increase the porosity of the first layer, (iii) in-furnace drying (110) the first layer, (iv) depositing (112) an additional thick dielectric layer on the upper surface of the first layer and carry out furnace drying, after the deposition of the respective layers, and (v) baking (114) the deposited layers, and (b) of forming (104) a conductor on the thick dielectric. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES |
title | METHOD OF MANUFACTURING MICROWAVE CIRCUIT |
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