METHOD OF MANUFACTURING MICROWAVE CIRCUIT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a microwave circuit, capable of manufacturing a transmission line as thin and narrow as possible, to the extent that the manufacturing process allows. SOLUTION: This method (100) for manufacturing the microwave circuit comprises the steps of...

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Bibliographische Detailangaben
Hauptverfasser: CASEY JOHN F, DOVE LEWIS R, RAU R FREDERICK JR, DREHLE JAMES R, JOHNSON ROSEMARY O, LIU LING
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a microwave circuit, capable of manufacturing a transmission line as thin and narrow as possible, to the extent that the manufacturing process allows. SOLUTION: This method (100) for manufacturing the microwave circuit comprises the steps of (a) depositing (102) a thick dielectric over a ground plane comprising (i) depositing (106) a first thick dielectric layer over the ground plane, (ii) drying (108) the first layer to degas a solvent to increase the porosity of the first layer, (iii) in-furnace drying (110) the first layer, (iv) depositing (112) an additional thick dielectric layer on the upper surface of the first layer and carry out furnace drying, after the deposition of the respective layers, and (v) baking (114) the deposited layers, and (b) of forming (104) a conductor on the thick dielectric. COPYRIGHT: (C)2005,JPO&NCIPI