SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To attain a low-cost semiconductor device that can be manufactured in a short period of time. SOLUTION: The semiconductor device comprises resistor elements 226-1 to 226-4 between wirings 225-11 to 225-41 and wirings 225-12 to 225-42, respectively, for connecting a semiconducto...

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Bibliographische Detailangaben
1. Verfasser: KONDOU KAZUHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To attain a low-cost semiconductor device that can be manufactured in a short period of time. SOLUTION: The semiconductor device comprises resistor elements 226-1 to 226-4 between wirings 225-11 to 225-41 and wirings 225-12 to 225-42, respectively, for connecting a semiconductor chip 241 and a semiconductor chip 242. The resistor elements 226-1 to 226-4 are designed to have an optimal value for every signal path, so that the semiconductor chips 241, 242 can be used as combined with a semiconductor chip of different performances, without modification or provision of a redundant circuit. This arrangement is applicable to a semiconductor that employs SIP technology. COPYRIGHT: (C)2005,JPO&NCIPI