ETCHING METHOD FOR MICROMACHINING CRYSTALLINE MATERIAL AND DEVICE MANUFACTURED BY THE METHOD

PROBLEM TO BE SOLVED: To provide an etching method for micromachining a crystalline material and to provide a device manufactured by using the method. SOLUTION: The invention relates to a method for combining directional ion etching and anisotropic wet etching and to a device and a structure fabrica...

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1. Verfasser:	STEINBERG DAN A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an etching method for micromachining a crystalline material and to provide a device manufactured by using the method. SOLUTION: The invention relates to a method for combining directional ion etching and anisotropic wet etching and to a device and a structure fabricated thereby. The invention is particularly applicable to silicon micromachining and provides architectures that combines crystallographic surfaces and vertical dry-etched surfaces together in the same structure. COPYRIGHT: (C)2005,JPO&NCIPI