MODULE WITH INSPECTION FUNCTION, AND ITS INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide a ball grid array package mounting module for preventing a practical drive signal from being distorted by minimizing the length of a test signal line, and also to provide its inspection method. SOLUTION: The module includes an inspection function part of a ball grid...

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Hauptverfasser: SO HEISEI, PARK SEICHU, RI SEIJON
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creator SO HEISEI
PARK SEICHU
RI SEIJON
description PROBLEM TO BE SOLVED: To provide a ball grid array package mounting module for preventing a practical drive signal from being distorted by minimizing the length of a test signal line, and also to provide its inspection method. SOLUTION: The module includes an inspection function part of a ball grid array package 110 (BGA package), and the inspection method uses the module. In the BGA package inspection function part, a signal line for testing is composed of a package test signal line and a board test signal line. The package test signal line 131 and the board test signal line 132 are separated from or connected to a connection part 133. COPYRIGHT: (C)2005,JPO&NCIPI
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
STATIC STORES
TESTING
title MODULE WITH INSPECTION FUNCTION, AND ITS INSPECTION METHOD
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