MODULE WITH INSPECTION FUNCTION, AND ITS INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide a ball grid array package mounting module for preventing a practical drive signal from being distorted by minimizing the length of a test signal line, and also to provide its inspection method. SOLUTION: The module includes an inspection function part of a ball grid...

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Bibliographische Detailangaben
Hauptverfasser:	SO HEISEI, PARK SEICHU, RI SEIJON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES STATIC STORES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ball grid array package mounting module for preventing a practical drive signal from being distorted by minimizing the length of a test signal line, and also to provide its inspection method. SOLUTION: The module includes an inspection function part of a ball grid array package 110 (BGA package), and the inspection method uses the module. In the BGA package inspection function part, a signal line for testing is composed of a package test signal line and a board test signal line. The package test signal line 131 and the board test signal line 132 are separated from or connected to a connection part 133. COPYRIGHT: (C)2005,JPO&NCIPI